P1 V23026 Relay
AXICOM
Packing
Soldering conditions according IEC 60058-2-58 and
Recommended Soldering Conditions Relays
Signal
AXICOM
AXICOM
P1 V23026 Relay
AXICOM
Soldering conditions according IEC 60058-2-58 Relay V23026 (Continued)
P1 V23026 Relay
IPC/JEDEC J-STD-020B
Recommended Soldering Conditions limits
Packing
Packing
Soldering conditions according IEC
60058-2-58 and limits
Recommended soldering conditions
IPC/JEDEC J-STD-020B
100 °C
RecommendedSolderingConditions
IPC/JEDEC J-STD-020B T elecom-, Signal and RF Relays
Dotted line: process
240 °C
Processing Packing
20 - 40 sec Full line: typical
Dotted line: process
240
180 °C
130°C
Soldering conditions according IEC 60058-2-58 and forced Tube for THT version
IPC/JEDEC J-STD-020B cooling 40 relays per tube, 2000 relays per box
180 °C
P1 V23026 Relay
T elecom-, Signal and RF Relays 108-98009 Rev. E
T elecom-, Signal and RF Relays
20 - 40 sec Full line: typical P1 V23026 Relay
T ube for
40 relays
2‘000 re
130 °C
240 °C
100 °C
20 - 40 sec
Full line: typical
forced
Dotted line: process limits
cooling
180 °C
130 °C
100 °C
Resistance to soldering heat - Re ow pro le
forced
cooling
V apor Phase Soldering: T emperature/ T ime Pro?le
(Lead and Housing Peak T emperature)
V apor Phase Soldering: T emperature/ T ime Pro?le
(Lead and Housing Peak T emperature)
Resistance to soldering heat - Re ow pro le
Vapor Phase Soldering:
temperature/time profile (lead
Resistance to soldering heat - Reflow profile and housing peak temperature)
Tape and reel for SMT
V apor Phase Soldering: T emperature/ T ime Pro?le
(Lead and Housing version Peak T emperature)
per
480 relays 11.6±0.2 reel, 2400 relays per box
T ape and
480 rela
2‘400 pe
Resistance to soldering heat - Re ow pro le
11.6±0.2
Reel dimension
Recommended re ow soldering pro le
Recommended reflow ow soldering pro le
Recommended soldering profile
Infrared Soldering: T emperature/ T ime Pro?le
(Lead and Housing Peak T emperature)
re
Time (s)
Time (s)
Time (s)
Infrared Soldering: temperature/
time profile (lead and housing
peak temperature)
Infrared Soldering: T emperature/ T ime Pro?le
(Lead and Housing Peak T emperature)
Reel dimension
11.6±0.2
Reel dimensions
Reel and
Infrared Soldering: T emperature/ T ime Pro?le
(Lead dimension Housing Peak T emperature)
Reel dimension
Recommended re ow soldering pro le
All speci?cations subject to change. Consult T yco Electronics for latest speci?cations.
Time (s)
Time (s)
Infrared Soldering: T emperature/ T ime Pro?le
(Lead and Housing Peak T emperature)
All speci?cations subject to change. Consult T yco Electronics for latest speci?cations.
Infrared Soldering: T emperature/ T ime Pro?le
(Lead and Housing Peak T emperature)
All speci?cations subject to change. Consult T yco Electronics for latest speci?cations.
Time (s) Infrared Soldering: T emperature/ T ime Pro?le
(Leadand subjectto T TycoElectronics
All speci?cations Housing change. Peak Consult emperature) for latest speci?cations.
All speci?cations subject to change. Consult T yco Electronics for latest speci?cations. 9 of 12
All speci?cations subject to change. Consult T yco Electronics for latest speci?cations.
4
02-2012, Rev. 0212 Datasheets and product specification Datasheets and product data is subject to the
www.te.com according to IEC 61810-1 and to be used terms of the disclaimer and all chapters of
? 2011 Tyco Electronics Corporation, only together with the ‘Definitions’ section. the ‘Definitions’ section, available at
a TE Connectivity Ltd. company http://relays.te.com/definitions
All speci?cations subject to change. Consult T yco Electronics for latest speci?cations.
9 of 12
Datasheets, product data, ‘Definitions’ sec-
tion, application notes and all specifications
are subject to change.
9 of 12
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